Mô tả
Key Applications
- Virtualization
- Cloud Computing
- Storage Headnode
- Data Center Optimized
- HPC
- CDN, Edge Nodes
Key Features
- Designed for Data Center Modular HardSP deploy
- All-in-one platform for cloud data centers, based on the OCP Data Center Modular Hardware System (DC-MHS) with flexible I/O and storage configurations
- Based on Modular Scalable DeNsity Optimized HPM Form Factor (M-SDNO)
- Support DC-SCM module with OpenBMC
- Single Intel® Xeon® 6 6700 series processor with E-cores
- 16 DIMM slots supporting up to 2TB of memory (6700E series CPU)
- Support FH DPU and single slot GPU
- Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible).
- Breeze through high throughput workloads with PCIe 5.0 NVMe drive support
- Trusted Platform Module (TPM) 2.0 9670 onboard
PRODUCT DATASHEET
