Mô tả
Key Features
- Intel® Xeon® Scalable Processors Supported
- Custom 6.8″ x 19.1″ Board Form Factor
- 165 W Max TDP
Specification
| Essentials | |
| Status | Launched |
| Launch Date | Q3’17 |
| Expected Discontinuance | Q4’19 |
| Limited 3-year Warranty | Yes |
| Extended Warranty Available for Purchase (Select Countries) |
Yes |
| Additional Extended Warranty Details | Intel® Compute Module HNS2000 Extended Warranty |
| # of QPI Links | 2 |
| Compatible Product Series | Intel® Xeon® Scalable Processors |
| Board Form Factor | Custom 6.8″ x 19.1″ |
| Chassis Form Factor | 2U Rack |
| Socket | Socket P |
| Integrated Systems Available | Yes |
| Integrated BMC with IPMI | Yes |
| Rack-Friendly Board | Yes |
| TDP | 165 W |
| Included Items | (1) 1U node tray(1) Intel® Server Board S2600BPB(1) Power Docking Board FHWBPNPB(3) 40x56mm dual rotor managed fans FXX4056DRFAN2(1) 1U passive Rear heat sink – CPU #1 – CuAL – FXXHP78X108HS(1) 1U passive heat sink – CPU #2 – AL – FXXEA78X108HS(1) Air duct(1) External VGA port bracket(1) Slot 1 riser card(1) Slot 2 riser card w/80mm M.2 SSD slot. Required Items – Sold Separately:One (1) bridge board option – AHWBPBGB, AHWBP12GBGB, AHWBP12GBGBR5 OR AHWBP12GBGBIT; One or two Intel® Xeon® processor Scalable family,Up to Sixteen (16) DDR4 RDIMM/LRDIMM |
| Recommended Customer Price | N/A |
| Board Chipset | Intel® C621 Chipset |
| Target Market | High Performance Computing |
| Supplemental Information | |
| Embedded Options Available | No |
| Description | A hot-pluggable high-density compute module integrated with the Intel® Server Board S2600BPB for large memory capability and flexible configuration options for the Intel® Server Chassis H2312XXLR3. |
| Additional Information URL | Link |
| Memory Specifications | |
| Max Memory Size (dependent on memory type) | 1.28 TB |
| Memory Types | DDR4 ECC RDIMM/LRDIMM 2133/2400/2666 |
| Max # of Memory Channels | 12 |
| Max Memory Bandwidth | 255.94 GB/s |
| Physical Address Extensions | 50-bit |
| Max # of DIMMs | 12 |
| ECC Memory Supported ‡ |
Yes |
| Processor Graphics | |
| Integrated Graphics ‡ | No |
| Graphics Output | VGA |
| Discrete Graphics | Supported |
| Expansion Options | |
| PCI Express Revision | 3.0 |
| Max # of PCI Express Lanes | 96 |
| PCIe x16 Gen 3 | 2 |
| Riser Slot 1: Total # of Lanes | 16 |
| Riser Slot 2: Total # of Lanes | 24 |
| Riser Slot 3: Total # of Lanes | 24 |
| Riser Slot 4: Total # of Lanes | 16 |
| I/O Specifications | |
| # of USB Ports | 2 |
| USB Revision | 3.0 |
| Total # of SATA Ports | 8 |
| RAID Configuration | RAID Levels 0/1/10/5/50 (LSI) |
| # of Serial Ports | 1 |
| # of LAN Ports | 2 |
| Integrated LAN | 2x 10GbE; 1x 1GbE (Dedicated Management) |
| Firewire | No |
| Embedded USB (eUSB) Solid State Drive Option | No |
| Integrated SAS Ports | 0 |
| Integrated InfiniBand* | No |
| Package Specifications | |
| Max CPU Configuration | 2 |
| Advanced Technologies | |
| Intel® Optane™ Memory Supported ‡ | Yes |
| Intel® Virtualization Technology for Directed I/O (VT-d) ‡ |
Yes |
| Intel® Remote Management Module Support | Yes |
| Intel® Node Manager | Yes |
| Intel® Rapid Storage Technology | No |
| Intel® Rapid Storage Technology enterprise | Yes |
| Intel® Fast Memory Access | Yes |
| Intel® Flex Memory Access | Yes |
| Intel® I/O Acceleration Technology | Yes |
| Intel® Advanced Management Technology | Yes |
| Intel® Server Customization Technology | Yes |
| Intel® Build Assurance Technology | Yes |
| Intel® Efficient Power Technology | Yes |
| Intel® Quiet Thermal Technology | Yes |
| TPM Version | 2.0 |
| Intel® Transparent Supply Chain |
|
| Includes Statement of Conformance and Platform Certificate |
No |
| Security & Reliability |
|
| Intel® AES New Instructions | Yes |
| Intel® Trusted Execution Technology ‡ | Yes |
