Mô tả
Key Feature
- Supports two Intel® Xeon® processor E5-2600 v4, 145 W maximum
- 16 memory sockets support LR/R-DIMMs, up to 1024 GB maximum memory per node
- Dual 1GbE (plus dual 10GbE on selected skus) network controller options available and an integrated management port
- All nodes, power supplies, and storage are hot-swappable
Specification
Essentials | |
Status | Launched |
Launch Date | Q4’15 |
Expected Discontinuance | Q3’20 |
Limited 3-year Warranty | Yes |
Extended Warranty Available for Purchase (Select Countries) |
Yes |
Additional Extended Warranty Details | Intel® Compute Module HNS2000 Extended Warranty |
# of QPI Links | 2 |
Compatible Product Series | Intel® Xeon® Processor E5-2600 v4 Family |
Board Form Factor | Custom 6.8″ x 18.9″ |
Chassis Form Factor | Rack |
Socket | Socket R3 |
Integrated Systems Available | No |
Integrated BMC with IPMI | IPMI 2.0 |
Rack-Friendly Board | Yes |
TDP | 145 W |
Included Items | Integrated compute module includes: (1) Intel® Server Board S2600TPR w/two 1Gb ports (Intel® Ethernet Controller I350); (1) 12Gb/s bridge board (FHWKPTPBGB24); (1) node power board (FH2000NPB2); (1) one slot PCIe x16 riser card (FHW1U16RISER2); (1) front 1U passive heat sinks (FXXEA84X106HS); (1) front 1U passive heat sinks (FXXEA84X106HS); (1) rear 1U passive heat sink (FXXCA91X91HS); (3) 4056 dual rotor fan (FXX4056DRFAN2); (1) Dual RJ-45 port 10GBASE-T I/O module (AXX10GBTWLHW3); (1) PCI Express* x16 rIOM riser and rIOM carrier board kit (AXXKPTPM2IOM); (1) airduct; (1) 1U node tray |
Recommended Customer Price | N/A |
Board Chipset | Intel® C612 Chipset |
Target Market | Cloud/Datacenter |
Supplemental Information |
|
Embedded Options Available | No |
Datasheet | Link |
Description | A hot-pluggable high-density compute module integrated with the Intel® Server Board S2600TPR for higher memory capability and flexible configuration options for the Intel® Server Chassis H2224XXKR2/H2224XXLR2. |
Additional Information URL | Link |
Memory Specifications |
|
Max Memory Size (dependent on memory type) | 1.02 TB |
Memory Types | DDR4-1600/1866/2133/2400 |
Max # of Memory Channels | 8 |
Max Memory Bandwidth | 153.6 GB/s |
Physical Address Extensions | 46-bit |
Max # of DIMMs | 16 |
ECC Memory Supported ‡ |
Yes |
Processor Graphics |
|
Integrated Graphics ‡ | Yes |
Graphics Output | VGA |
Discrete Graphics | Supported |
Expansion Options |
|
PCI Express Revision | 3.0 |
Max # of PCI Express Lanes | 64 |
PCIe x16 Gen 3 | 1 |
Connector for Intel® I/O Expansion Module x8 Gen 3 | 1 |
Riser Slot 1: Total # of Lanes | 16 |
Riser Slot 2: Total # of Lanes | 16 |
Riser Slot 3: Total # of Lanes | 24 |
Riser Slot 4: Total # of Lanes | 16 |
I/O Specifications | |
# of USB Ports | 4 |
USB Revision | 2.0 |
Total # of SATA Ports | 6 |
RAID Configuration | NO |
# of Serial Ports | 1 |
# of LAN Ports | 4 |
Integrated LAN | 2x 1GbE + 2x 10GbE RJ45 |
Embedded USB (eUSB) Solid State Drive Option | No |
Integrated SAS Ports | 6 |
Integrated InfiniBand* | No |
Package Specifications |
|
Max CPU Configuration | 2 |
Advanced Technologies |
|
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ |
Yes |
Intel® Remote Management Module Support | Yes |
Intel® Node Manager | Yes |
Intel® Quick Resume Technology | Yes |
Intel® Quiet System Technology | Yes |
Intel® Fast Memory Access | Yes |
Intel® Flex Memory Access | Yes |
Intel® I/O Acceleration Technology | Yes |
Intel® Advanced Management Technology | Yes |
Intel® Server Customization Technology | Yes |
Intel® Build Assurance Technology | Yes |
Intel® Efficient Power Technology | Yes |
Intel® Quiet Thermal Technology | Yes |
Security & Reliability |
|
Intel® Trusted Execution Technology ‡ | No |